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Wafer Map

pateikė Oplab

Nemokama bandomoji versija
Atsisiųsti pavyzdįInstrukcijos

Advanced visual for test data, failure patterns, wafer yield, and process capability analysis

Wafer Map is a Power BI custom visual for wafer map, die value map, bin map, test result, and manufacturing process analysis. It helps yield, product, test, process, and quality engineers inspect test results, distributions, and capability signals inside standard Power BI reports.

Designed for wafer, test, and manufacturing analysis

Wafer Map renders test data as wafer maps, hierarchy-level maps, or 1D sequence grids. Use it to review pass/fail patterns, bin distributions, numeric measurements, status classifications, metric variation, process limits, and summary statistics without leaving Power BI.

  • Render maps from Power BI fields: bind wafer or process hierarchy, required Die X or sequence position, optional Die Y, Die Value, Die Classification, and optional Count.
  • Support XY and X-only data: bind Die Y for true XY wafer coordinates, or leave Die Y unbound to render ordered test results, inspection sequences, or process samples as an X-only grid.
  • Review multiple groups: render wafers, lots, stations, batches, panels, or other groups present in the current Power BI data view and use hierarchy fields for native drilldown.
  • Compare raw and rolled-up data: bind Count to show Total Dies beside Displayed Dies in the status panel.
  • Inspect engineering patterns: review edge effects, clusters, streaks, random failures, missing results, untested items, excluded items, and invalid rows.

Typical workflows

Use Wafer Map for semiconductor quality review, probe and final test analysis, yield-loss investigation, lot review, wafer comparison, bin-map inspection, ordered test-data review, manufacturing process monitoring, and engineering dashboards that need spatial or sequence-based context.

  • Compare wafers, lots, stations, batches, panels, or other hierarchy levels.
  • Review pass, fail, untested, excluded, and invalid states.
  • Visualize categorical classifications, binned metric ranges, or numeric measurement values.
  • Swap between multiple bound Die Value or Die Classification fields from the toolbar.
  • Use pass/fail highlighting, legend focus, wafer focus, and brush selection to inspect patterns.
  • Use summaries to assess yield, distribution shape, total counts, and top failure patterns.
  • Use optional process capability controls to evaluate Cp, Cpu, Cpl, and Cpk for active numeric fields.
  • Investigate coordinate, data-shape, and row-limit diagnostics directly in the visual.

Status panel and process capability

The status panel shows the active scope, selected encoding, distribution chart, summary statistics, legend, and optional process capability controls. When the Die Value setting Process Capability is enabled, the panel shows LSL and USL inputs for the active Die Value field and calculates capability rows such as Cp, Cpu, Cpl, and Cpk when enough numeric data is available.

Trial functionality

Wafer Map can be evaluated in trial mode. In unlicensed production trial mode, the visual processes only the first 1000 input rows and shows an in-visual diagnostic when rows are limited. A paid license is required for full report-scale datasets.

Data setup

Prepare die-level tabular data before it reaches the visual. Wafer Map assumes the provided hierarchy and Die X/Y mapping resolve to raw die-level data. If Power BI has already rolled up the data, statistics and distributions may not represent raw dies because they are calculated from the rows provided to the visual. To check this, bind a count measure to Count and confirm that Displayed Dies matches Total Dies in the status panel.

Bind Die X as the required coordinate or sequence field. Bind Die Y for true 2D wafer maps, or leave Die Y unbound for X-only sequence-grid rendering. Wafer hierarchy is optional and can represent wafer, lot, station, batch, panel, or drilldown grouping. Die Value and Die Classification fields are optional and can be bound multiple times for toolbar-swappable encodings.

Who it is for

Wafer Map is intended for semiconductor engineering, manufacturing quality, product engineering, test engineering, process engineering, operations, and BI teams that need practical spatial, sequence-grid, or process-capability inspection inside Power BI.

Vaizdinio elemento galimybės

Šis vaizdinis elementas sertifikuotas „Power BI“

Trumpa apžvalga

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