Wafer Map

Wafer Map is a Power BI custom visual for semiconductor wafer maps, die value maps, bin maps, and yield-loss review. It helps yield, product, test, and process engineers inspect die-level results inside standard Power BI reports.

Designed for semiconductor analysis

Wafer Map renders table-shaped die data as wafer or hierarchy-level maps. Use it to review pass/fail patterns, bin distributions, numeric die values, status classifications, metric variation, process limits, and wafer-level summaries without leaving Power BI.

• Render wafer maps from Power BI fields: bind wafer hierarchy, required Die X, optional Die Y, Die Value, Die Classification, and optional Count.
• Support XY and X-only data: bind Die Y for true XY wafer coordinates, or leave Die Y unbound to render an X-only sequence grid.
• Review multiple wafers: render wafers present in the current Power BI data view and use wafer hierarchy fields for native drilldown.
• Compare raw and rolled-up data: bind Count to show Total Dies beside Displayed Dies in the status panel.
• Inspect engineering patterns: review edge effects, clusters, scratch-like lines, random failures, missing dies, untested dies, excluded dies, duplicate coordinates, and invalid rows.

Typical workflows

Use Wafer Map for semiconductor quality review, probe and final test analysis, yield-loss investigation, lot review, wafer comparison, bin-map inspection, die value review, and engineering dashboards that need wafer-shaped context.

• Compare wafers within a lot or hierarchy level.
• Review pass, fail, untested, excluded, and invalid die states.
• Visualize categorical classifications, binned metric ranges, or numeric die values.
• Swap between multiple bound Die Value or Die Classification fields from the toolbar.
• Use pass/fail highlighting, legend focus, wafer focus, and brush selection to inspect patterns.
• Use wafer summaries to assess yield, distribution shape, total die counts, and top failure patterns.
• Investigate coordinate, duplicate-row, and row-limit diagnostics directly in the visual.

Status panel and process capability

The status panel shows the active scope, selected encoding, distribution chart, summary statistics, legend, and optional process capability controls. When the Die Value setting Process Capability is enabled, the panel shows LSL and USL inputs for the active Die Value field and calculates capability rows such as Cp, Cpu, Cpl, and Cpk when enough numeric data is available.

Trial functionality

Wafer Map can be evaluated in trial mode. In unlicensed production trial mode, the visual processes only the first 1000 input rows and shows an in-visual diagnostic when rows are limited. A paid license is required for full report-scale datasets.

Data setup

Prepare die-level tabular data before it reaches the visual. Wafer Map assumes the provided hierarchy and Die X/Y mapping resolve to raw die-level data. If Power BI has already rolled up the data, statistics and distributions may not represent raw dies because they are calculated from the rows provided to the visual. To check this, bind a count measure to Count and confirm that Displayed Dies matches Total Dies in the status panel.

Bind Die X as the required coordinate field. Bind Die Y for true 2D wafer maps, or leave Die Y unbound for X-only sequence-grid rendering. Wafer hierarchy is optional and can be used for wafer, lot, or drilldown grouping. Die Value and Die Classification fields are optional and can be bound multiple times for toolbar-swappable encodings.

Who it is for

Wafer Map is intended for semiconductor engineering, manufacturing quality, product engineering, test engineering, process engineering, and BI teams that need practical wafer-map inspection inside Power BI.